3D chip stacking with C4 technology

IBM Journal of Research and Development, no. 6 (2008): 599-609

Cited by: 35|Views33
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Abstract:

Three-dimensional (3D) integration technology promises to continue enhancing integrated-circuit system performance with high bandwidth, low latency, low power, and a small form factor for a variety of applications. In this work, conventional C4 (controlled-collapse chip connection) technology is studied for robust interconnection between ...More

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