An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects.

Timothy O. Dickson,Yong Liu,Sergey V. Rylov,Bing Dang,Cornelia K. Tsang,Paul S. Andry,John F. Bulzacchelli,Herschel A. Ainspan,Xiaoxiong Gu,Lavanya Turlapati,Michael P. Beakes,Benjamin D. Parker,John U. Knickerbocker,Daniel J. Friedman

IEEE Journal of Solid-State Circuits（2012）

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摘要

A source synchronous I/O system based on high-density silicon carrier interconnects is introduced. Benefiting from the advantages of advanced silicon packaging technologies, the system uses 50 μm-pitch μC4s to reduce I/O cell size and fine-pitch interconnects on silicon carrier to achieve record-breaking interconnect density. An I/O architecture is introduced with link redundancy such that any lin...

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关键词

Silicon,Receivers,Clocks,Calibration,Decision feedback equalizers,Integrated circuit interconnections,CMOS integrated circuits

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