Predicting the Drop Performance of Solder Joints by Evaluating the Elastic Strain Energy from High-Speed Ball Pull Tests

Journal of Electronic Materials, Volume 38, Issue 3, 2009, Pages 410-414.

Cited by: 27|Bibtex|Views0|DOI:https://doi.org/10.1007/s11664-008-0633-y
Other Links: academic.microsoft.com|link.springer.com

Abstract:

Despite being expensive and time consuming, board-level drop testing has been widely used to assess the drop or impact resistance of the solder joints in handheld microelectronic devices, such as cellphones and personal digital assistants (PDAs). In this study, a new test method, which is much simpler and quicker, is proposed. The metho...More

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