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Effects of Substrate Morphology and Postelectrodeposition on Structure of Cu Foam and Their Application for Li-Ion Batteries

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, no. 5 (2010): D269-D273

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The effects of Cu substrate morphology and postelectrodeposition on the porosity and mechanical strength of Cu foam electrodeposits are examined. The porosity of the Cu foam is enhanced by changing the morphology of the Cu substrate from smooth to nodular because H-2 bubbles are split into small bubbles by the nodules. In addition, the ad...更多

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