Effect of surface finish on the fracture behavior of Sn–Ag–Cu solder joints during high-strain rate loading
Journal of Alloys and Compounds(2009)
摘要
This study assesses the reliability of eutectic Sn–Pb, Sn–1.0Ag–0.5Cu, Sn–3.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu solder bumps on three different pad surface finishes (ENIG, electrolytic Ni/Au and Cu-OSP) with and without an aging treatment at 150°C for 100h. This study focused primarily on how the pad surface finish and solder alloy composition affects the reliability of solder joints using a high-speed ball pull test method. The fracture forces and failure mechanisms were also examined. The results showed that the electrolytic Ni/Au surface finish had the highest fracture forces for all four different solder alloys with and without the aging process.
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关键词
Solder joint,Sn–Ag–Cu,Surface finish,Surfaces and interfaces,Mechanical properties,Intermetallics
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