Effect of surface finish on the fracture behavior of Sn–Ag–Cu solder joints during high-strain rate loading

Journal of Alloys and Compounds, pp. 242-245, 2009.

Cited by: 22|Bibtex|Views0|DOI:https://doi.org/10.1016/j.jallcom.2009.07.085
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Abstract:

This study assesses the reliability of eutectic Sn–Pb, Sn–1.0Ag–0.5Cu, Sn–3.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu solder bumps on three different pad surface finishes (ENIG, electrolytic Ni/Au and Cu-OSP) with and without an aging treatment at 150°C for 100h. This study focused primarily on how the pad surface finish and solder alloy composition a...More

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