Evolution of surface width in electrochemical nucleation and growth

Electrochemistry Communications(2010)

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摘要
The evolution of surface width during growth of copper islands is studied in the kinetic regime, allowing control of island shape as well as island density. We show that film roughness at island coalescence is determined by island density, island shape, and the island growth kinetics. The connection between the kinetics of island growth and film growth provides the scientific basis for control of surface roughness.
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关键词
Electrodeposition,Kinetic roughening,Nucleation and growth,Dynamic scaling,Copper deposition
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