Advanced Manufacturing Technologies and Characterization of the Microelectronic Interconnect and Packaging Materials

This paper reviews the research work and achievements on microelectronic interconnect and packaging materials, and the advanced manufacturing technologies in General Research Institute for Non-ferrous Metals. Several kinds of novel lead-free alloys, such as Sn-Ag-Cu-Cr, Sn-Zn-X, Sn-Bi-Cu have been studied. The effect of micro alloying on the tin-based solder has been investigated. Ultrasonic atomization has been applied to the advanced powder fabrication. Lead-free BGA balls and SiCp/Al composites have been manufactured for the use of microelectronic packaging materials. Based on the principle of formation of the capillary wave and the behavior of perturbed molten metal jet, the cost-effective fabricating technique of BGA lead-free solder balls has been developed, which provides a tight control of size distribution of the particles with spherical shape. In addition, we focus on the SiCp/Al metal-matrix composite as one of the new electronic packaging materials. The pressure infiltration technique has been employed to fabricate Al-matrix composites with different reinforced particles, which are the packaging materials for LED products. The microstructure, morphology and the electrical and thermal properties of these materials are characterized by optical microscope, SEM and X-ray diffraction.