A New High-Density Twin-Gate Isolation One-Time Programmable Memory Cell in Pure 28-nm CMOS Logic Process

Electron Devices, IEEE Transactions  (2015)

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摘要
A new and compact high-k dielectric breakdown one-time programmable (OTP) cell in pure 28-nm high-k metal gate (HKMG) process is proposed. By adopting a self-aligned twin-gate isolation (TGI) made by merged gate spacer, the new OTP cell can operate independently with a very small cell area. Fabricated by a pure 28-nm HKMG CMOS logic process, this OTP cell successfully achieves an ultrasmall cell size of 0.0441 μm2 on 28-nm HKMG CMOS logic platform. Using high-k dielectric breakdown as its program mechanism, the antifuse TGI OTP memory has more than three orders of ON/OFF read window with a low program voltage of 4 V in 20 μs. Furthermore, a highly density 64-kbit TGI OTP array has been fabricated and successfully demonstrates the new superior isolation and reliability performances.
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关键词
cmos logic circuits,electric breakdown,high-k dielectric thin films,integrated circuit reliability,hkmg process,on-off read window,otp cell,antifuse memory,gate spacer,high-density twin-gate isolation one-time programmable memory cell,high-k dielectric breakdown,high-k metal gate process,isolation performances,pure cmos logic process,reliability performances,self-aligned tgi,size 28 nm,time 20 mus,voltage 4 v,antifuse,logic nonvolatile memory (nvm),one-time programmable (otp) memory,one-time programmable (otp) memory.
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