Performance modeling for emerging interconnect technologies in CMOS and beyond-CMOS circuits

ISLPED, pp. 63-68, 2014.

Cited by: 0|Bibtex|Views6|DOI:https://doi.org/10.1145/2627369.2631638
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Other Links: dl.acm.org|dblp.uni-trier.de|academic.microsoft.com

Abstract:

In this paper, emerging low-power interconnect options for CMOS and beyond CMOS technologies are reviewed. First, electrical interconnects based on carbon nanotubes and graphene nanoribbons are discussed. It is found that carbon-based electrical interconnects can potentially outperform their conventional Cu counterpart at technology nodes...More

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