Packaging of silicon photonics systems

P De Dobbelaere,Ali Ayazi,Yusong Chi,Annette Veberg Dahl, S Denton,Steffen Gloeckner,Kamyan Hon, S Hovey, Yun Liang,Michael H Mack,Gianlorenzo Masini,Attila Mekis, Margaret G E Peterson,Thierry Pinguet,Jesper Schramm, Michael Sharp,C Sohn, K Stechschulte,Peng Sun, G Vastola,L Verslegers, Rui Zhou

Optical Fiber Communications Conference and Exhibition（2014）

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摘要

We address the effects of packaging on performance, reliability and cost of photonic devices. For silicon photonics we address some specific packaging aspects. Finally we propose an approach for integration of photonics and ASICs.

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关键词

application specific integrated circuits,elemental semiconductors,integrated optics,packaging,reliability,silicon,asic,si,cost,integration,performance,photonic devices,silicon photonics systems,assembly,photonics

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