Thermal and electrical effects of staggered micropin-fin dimensions for cooling of 3D microsystems
Thermal and Thermomechanical Phenomena in Electronic Systems（2014）
摘要
Microfluidic cooling shows promise in cooling next generation 3D microsystems when integrated with through-silicon-vias. In this work, electrical and thermal effects of staggered micropin-fin heat sink dimensions are analyzed using deionized water. An experimental study of five different silicon micropin-fin arrays with a nominal height of 200 μm and diameters down to 30 μm was conducted at flow rates up to approximately 100mL/min and pressure drops up to approximately 200 kPa. The lowest convective thermal resistance achieved was 0.098 °C/W across a 1 cm2 die. These experimental results were then used to simulate temperature profiles of an interposer-cooled 3D stack.
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关键词
convection,cooling,elemental semiconductors,heat sinks,integrated circuit design,microfabrication,microfluidics,micromechanical devices,silicon,thermal engineering,thermal resistance,three-dimensional integrated circuits,3d microsystem,si,convective thermal resistance,deionized water,electrical effect,interposer-cooled 3d stack,microfluidic cooling,silicon micropin-fin array,size 200 mum,staggered micropin-fin heat sink dimension,thermal effect,through-silicon-vias integration,3d ic,interposer,micro pin fin
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