Interposer-to-interposer electrical and silicon photonic interconnection platform using silicon bridge
San Diego, CA(2014)
摘要
Developing solutions that provide high-bandwidth and low-energy communication has been at the forefront of interconnect and packaging research [1]. Within a module, the challenge has been addressed by using novel 2.5D (silicon interposer) and 3D stacking for short and high-density electrical interconnections and silicon photonics based interconnects. However, wafer-level batch fabricated solutions for high-bandwidth and low-energy interconnection between modules remain largely missing. Fig. 1 illustrates three approaches for package-to-package communication: through the motherboard, Flex connection [2], and using optical fibers. Electrical connectivity through the motherboard is both bandwidth limited and energy consuming. The use of Flex connection provides lower loss channels, however it requires a serial assembly process, which may limit its scalability. Methods involving optical fibers suffer the same limitation and are limited to relatively large interconnect pitches.
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关键词
integrated optics,integrated optoelectronics,optical communication equipment,optical fibre communication,optical fibre fabrication,optical interconnections,silicon,wafer level packaging,2.5d silicon interposer,3d stacking,flex connection,si,electrical connectivity,high-bandwidth communication,high-bandwidth interconnection,high-density electrical interconnection,interconnect pitches,interposer-to-interposer electrical interconnection platform,loss channels,low-energy communication,low-energy interconnection,modules,motherboard,optical fibers,package-to-package communication,packaging research,scalability,serial assembly process,short electrical interconnections,silicon bridge,silicon photonic interconnection platform,silicon photonics based interconnect,wafer-level batch fabricated solutions
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