Endpoint Detection in Low Open Area TSV Fabrication Using Optical Emission Spectroscopy

Components, Packaging and Manufacturing Technology, IEEE Transactions  , Volume 4, Issue 7, 2014, Pages 1251-1260.

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Abstract:

Through-silicon via (TSV) technology is a key enabler for 3-D and 2.5-D integration, which provides low-power and high-bandwidth chip-to-chip communication. During TSV fabrication, over-etching may cause notching at the base of the TSVs, resulting in TSV diameter variations. Endpoint detection (EPD) techniques are critical for controlling...More

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