Fabrication of VGA Size Near-Infrared Image Sensor Using Room-Temperature Flip-Chip Bonding Technology

Takanori Shuto,Keiichiro Iwanabe,Mutsuo Ogura,Katsuhiko Nishida,Tanemasa Asano

The Japan Society of Applied Physics（2014）

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摘要

Room-temperature bonding technique using cone-shaped microbumps with the aid of ultrasonic vibration is applied to the fabrication of a near-infrared image sensor. The image sensor is fabricated using the flip-chip bonding of an InGaAs/InP photodiode-array chip and a Si CMOS readout IC chip. The pixel pitch is 15 μm to compose VGA class (640 × 512 pixels) resolution. High-quality imaging of a heated object and blood vessels of human hand is demonstrated.

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关键词

CMOS integrated circuits,elemental semiconductors,flip-chip devices,gallium arsenide,image sensors,indium compounds,integrated circuit bonding,photodiodes,readout electronics,silicon,CMOS readout IC chip,InGaAs-InP,Si,VGA class resolution,VGA size near-infrared image sensor fabrication,blood vessels,flip-chip bonding technology,heated object,high-quality imaging,human hand,photodiode-array chip,temperature 293 K to 298 K,ultrasonic vibration

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