Tiny physical defects inspection by optimized EBI methodology

Hsiangchou Liao,Tuung Luoh, Lingwuu Yang,Tahone Yang,Kuangchao Chen,Chihyuan Lu,Donghua Liu,Rong Lv,Chingyun Hsiang,Chenmin Hu

e-Manufacturing and Design Collaboration Symposium（2014）

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摘要

An optimization of e beam inspection (EBI) new methodology is implemented to monitor the defective issues in semiconductor manufacturing. The benefits of optimized e beam inspection methodology not only can switch the care area among the inspection tools, but also minimize the inspection shots and the time consumption in EBI application. Inspect tiny physical defects with high throughput using EBI inspection become viable by adopting the new optimized inspection methodology.

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关键词

inspection,semiconductor device manufacture,optimized ebi methodology,optimized e beam inspection methodology,physical defect inspection,semiconductor manufacturing,manufacturing,optical switches,optimization,throughput,sensitivity

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