Pb-free microjoints (50 /spl mu/m pitch) for the next generation microsystems: the fabrication, assembly and characterization

San Diego, CA, 2006, Pages 1210-+.

Cited by: 39|Views23
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Abstract:

To support the next generation highly integrated microsystem with 3D silicon integration using fine pitch interconnection and Si carrier, we develop a fabrication and assembly process at IBM Research to produce solder micro-joints (fine pitch flip-chip interconnections) for our system-on-package (SOP) technology. We fabricate solder bumps...More

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