System-in-package for extreme environments
Lake Buena Vista, FL(2008)
摘要
The moon and Mars are extreme environments for electronics in terms of both low temperatures and wide temperature extremes. A system-in-package (SiP) approach has been chosen to build electronics capable of operating in these extreme environments without the need for warm electronics boxes to maintain an earth-like environment. The SiP is based on thin film copper/polyimide substrate technology with embedded passive components. Both wire bond and flip chip assembly are being used. The assembly is hermetically packaged in an alumina package.
更多查看译文
关键词
flip-chip devices,lead bonding,system-in-package,alumina package,copper substrate,extreme environments,flip chip assembly,hermetic package,polyimide substrate,thin film,wire bond assembly,copper,temperature,mars,assembly,flip chip,transistors,system in package,electronics packaging,moon
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络