High-Performance AlN/GaN HEMTs on Sapphire Substrate With an Oxidized Gate Insulator

Electron Device Letters, IEEE(2011)

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摘要
This letter presents transistor device results on ultrathin AIN/GaN high-electron mobility transistors grown on a sapphire substrate with high dc/RF performance, including low gate leakage and high transconductance. Devices with 80and 180-nm T-gates are compared, which demonstrate drain-induced OFF-state gate leakage currents below 10-6 A/mm and extrinsic transconductance gm ~ 500 mS/mm by utilizing a ~2-3 nm amorphous oxide layer formed under the T-gate during processing. In addition, excellent dc results such as RC <; 0.50 Ω · mm and pulsed IDS,max ~1.75 A/mm are reported. Small-signal RF performance using an 80-nm T-gate achieved ft >; 100 GHz operation, which is among the best so far reported for AIN/GaN technology.
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iii-v semiconductors,aluminium compounds,gallium compounds,high electron mobility transistors,sapphire,wide band gap semiconductors,aln-gan,hemt,t-gate,amorphous oxide layer,drain-induced off-state gate leakage current,extrinsic transconductance,oxidized gate insulator,sapphire substrate,size 180 nm,size 80 nm,transistor device,ultrathin high-electron mobility transistors,aluminum nitride,high-electron-mobility transistor (hemt),lattice strain,low gate leakage,leakage current,logic gates,high electron mobility transistor,logic gate
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