Three-Dimensional Solenoids Realized via High-Density Deep Coil Stacking for MEMS Application
Electron Device Letters, IEEE(2012)
摘要
Three-dimensional solenoids have been developed and demonstrated for the first time in stacking of through-silicon via chips. High-density microcoils (width, space, and depth with 24 turns) were completely filled with Cu. Eight high-density microcoil chips were stacked using a conductive adhesive. The inductance of the eight stacked high-density microcoil chips is measured to be at 0.9 MHz, and the maximum magnetic field reaches to 0.67 mT, as characterized by a magnetic field detector 2 mm above the cavity center of the coils. The eight stacked high-density microcoil chips achieved 66-h operation under continuous current (0.2 A) stress testing without failure. Two microcoil chips stacked using solder also completed 1000 thermal cycles (to 125) successfully with merely 3.7% resistance change.
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关键词
conductive adhesives,copper,micromechanical devices,solenoids,3d solenoids,cu,mems application,conductive adhesive,figh-density microcoils,high-density deep coil stacking,magnetic field detector,stress testing,through-silicon via chips,time 66 h,3-d solenoids,inductance,magnetic field,reliability,through-silicon via (tsv) technology,chip,through silicon via,stacking,three dimensional,thermal cycling,silicon,saturation magnetization
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