VOC induced particle generation during wafer transportation and its solution
Advanced Semiconductor Manufacturing Conference（2010）
摘要
In this paper, we describe a particle generation issue on 300 mm wafers during wafer shipping and transportation while using a FOSB (Front Opening Shipping Box) for the wafer shipping container. The analysis work associated with this defect generation issue and its prevention scheme will also be discussed.
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关键词
containers,goods distribution,organic compounds,semiconductor materials,surface contamination,fosb,voc induced particle generation,front opening shipping box,volatile organic compounds,wafer shipping,wafer transportation,voc,particles,transportation,wafer,adders,shape,air transportation
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