An ILP algorithm for voltage-island generation considering temperature in 3D-Ics
Electric Information and Control Engineering（2011）
摘要
To reduce interconnect delay and improve chip performance, three-dimensional chip emerges with the rapid increasing of chip integration as well as chip power density. Therefore, the thermal optimization issue is one of the most serious challenges in 3D IC designs. With some low power technologies such as multi-supply voltage designs, the thermal management and the layout optimization becomes even more complex for 3D designs. In this paper, an ILP formulation is proposed to optimize not only the temperature distribution, but also power-network routing resources and the timing constraint. Experimental results show that, compared with original algorithm, our algorithm can obtain a lower chip temperature and the decrease of temperature exceeds performance overhead distinctly.
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关键词
integer programming,integrated circuit interconnections,linear programming,low-power electronics,microprocessor chips,three-dimensional integrated circuits,3d integrated circuit designs,ilp algorithm,chip integration,chip performance,chip power density,integer linear programming,interconnect delay,layout optimization,low power technologies,multisupply voltage designs,power-network routing resources,temperature distribution,thermal management,thermal optimization,three-dimensional chip,voltage-island generation,algorithm design,low power electronics,algorithm design and analysis,information science,optimization,chip,design automation,three dimensional,network routing,integrated circuit,power density
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