Endpoint detection using optical emission spectroscopy in TSV fabrication

Interconnect Technology Conference, 2013, Pages 1-3.

Cited by: 0|Views2
EI WOS

Abstract:

A hybrid partial least squares-support vector machine (PLS-SVM) model of optical emission spectroscopy data is proposed and successfully demonstrated to predict the endpoint detection of through silicon vias (TSVs) etched using the Bosch process. Accurate results are shown for TSVs with diameters of 80 μm and 25 μm.

Code:

Data:

Get fulltext within 24h
Bibtex
Upload PDF

1.Your uploaded documents will be check within 24h, and coins will be credited to your account.

2.As the current system does not support cash withdrawal, you can add staff WeChat (AMxiaomai) to receive it as a red packet.

3.10 coins will be exchanged for 1 yuan.

?

Upload a single paper

for 5 coins

Wechat's Red Packet
?

Upload 50 articles

for 250 coins

Wechat's Red Packet
?

Upload 200 articles

for 1000 coins

Wechat's Red Packet
?

Upload 500 articles

for 2500 coins

Wechat's Red Packet
?

Upload 1000 articles

for 5000 coins

Wechat's Red Packet
Your rating :
0

 

Tags
Comments