Design And Fabrication Of In-Vitro Electroporation Chip For Gene Transfection

This paper presents the design and fabrication of an array-type bio-chip with a novel 3-D electrode structure for gene delivery. The bio-chip enables the processes of gene delivery and cell culturing to be performed in a single device. The genes are introduced into the host cell via a process of electroporation induced by the application of a transient electric field to the electrodes of the bio-chip. The 3-D electrode structure for gene delivery can cause the position of the positive and negative electrode is different. When the position of the positive and negative electrode is different, the electroporation and electrophoretic forces are applied at the same time. The bio-chip comprises three major components, namely a reaction chamber, a cell accommodating structure, and a 3-D interdigitated electrode arrangement. The chip is fabricated using conventional Micro-Electro Mechanical Systems (MEMS) techniques. The study establishes two different types of foundation plates the array type gene delivery to breed the chip, and use electricity pulse electric field test, may effectively improve strengthens the electric field power, enhances the chip transformation to breed the function. This result indicates that the efficiency of 3-D structure bio-chip is high than the plane structure by using water testing.