Ceramic joining: Part I Partial transient liquid-phase bonding of alumina via Cu/Pt interlayers

A method of ceramic-ceramic joining that exploits a thin layer of a transient liquid phase to join alumina to alumina has been developed, and the results of its application to joining alumina are reported. Through the use of microdesigned multilayer Cu/Pt interlayers, transient liquid-phase joining has been achieved at 1150°C, yielding an interlayer that is platinum-rich at temperatures substantially lower than those required for solid-state diffusion bonding with pure platinum interlayers. Flexure tests indicate that ceramic/metal interface strengths exceeding those of the ceramic can be achieved.