3-dimensional circuit device fabrication process using stereolithography and direct writing

Additive manufacturing (AM) technology is a method to fabricate a 3-dimensional structure by stacking thin layers. Among AM technologies, it is known that stereolithography (SL) technology can fabricate a structure having high dimensional accuracy. Recently, this technology is being applied for real manufacturing. Meanwhile, direct writing (DW) technology has been used to apply a lowviscosity liquid material on a substrate. In this regards, in this research, we applied the DW technology to deposit a conductive material on the surface of a three-dimensional structure. Moreover, a three-dimensional circuit device (3DCD) which is different from conventional two-dimensional PCBs can be fabricated by the hybrid process of SL and DW technologies. An insulated structure of circuit board having high precision was fabricated using stereolithography. Furthermore, a circuit is fabricated on the several layers using DW. And the 3DCD sample that detects a light was fabricated, successfully.