Stress Evolution During The Oxidation Of Silicon Nanowires In The Sub-10 Nm Diameter Regime

APPLIED PHYSICS LETTERS(2011)

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摘要
Using a reactive molecular dynamics simulation, the oxidation of Si nanowires (Si-NWs) with diameters of 5, 10, and 20 nm was investigated. The compressive stress at the interface between the oxide and the Si core decreased with increasing curvature in the sub-10 nm regime of the diameter, in contrast to the theory of self-limiting oxidation where rigid mechanical constraint of the Si core was assumed. The Si core of the thinner Si-NW was deformed more with surface oxidation, resulting in a lower compressive stress at the interface. These results explain the experimental observation of full oxidation of very thin Si-NWs. (C) 2011 American Institute of Physics. [doi:10,1063/1.3643038]
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关键词
compressive strength, deformation, elemental semiconductors, internal stresses, molecular dynamics method, nanowires, oxidation, shear modulus, silicon
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