Airgap Interconnects: Modeling, Optimization, and Benchmarking for Backplane, PCB, and Interposer Applications

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2014.

Cited by: 6|Bibtex|Views3|DOI:https://doi.org/10.1109/TCPMT.2014.2326798
Other Links: academic.microsoft.com

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