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Airgap Interconnects: Modeling, Optimization, and Benchmarking for Backplane, PCB, and Interposer Applications

paul a kohl
paul a kohl
rizwan bashirullah
rizwan bashirullah
li zheng
li zheng
erdal uzunlar
erdal uzunlar
rohit sharma
rohit sharma
vachan kumar
vachan kumar
azad naeemi
azad naeemi
muhannad s bakir
muhannad s bakir

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2014.

Cited by: 6|Bibtex|Views3|DOI:https://doi.org/10.1109/TCPMT.2014.2326798
Other Links: academic.microsoft.com

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