Reliability testing of through-silicon vias for high-current 3D applications

Electronic Components and Technology Conference, pp. 879-+, 2008.

Cited by: 11|Views19


A robust through-silicon via technology is necessary for high-power, high-performance 3D-silicon applications. To study through-via interconnection reliability, modules consisting of a test chip, silicon carrier interposer with through-vias, and ceramic substrate were constructed. A socket assembly containing a microchannel water cooler w...More



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