Residue-Free Dry Etching of Polymer Sacrificial Layer for Microelectromechanical-System Device Fabrication
ECS Transactions(2012)
摘要
Residue-free dry etching of a photosensitive-polymer sacrificial layer using O-2/CF4/CO-plasma exposure is described for the fabrication of microelectromechanical-system (MEMS) devices. Energy dispersive X-ray spectroscopy reveals that O-2/CF4/CO-plasma exposure removes polymer sacrificial layers without leaving residue and severely damaging Au structures. Since the O-2/CF4/CO-plasma exposure hardly damages Au structures, this process is applicable for the removal of sacrificial layers for MEMS with Au structures.
更多查看译文
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要