Multilevel interconnect networks for the end of the roadmap: Conventional Cu/low-k and emerging carbon based interconnectsMarkahmet ceyhan[0]azad naeemi[0]2011.Cited by: 1|Bibtex|Views1|DOI:https://doi.org/10.1109/IITC.2011.5940314Other Links: academic.microsoft.comKeywords: resistancepower dissipationcapacitancechipgrapheneMore(3+)Code: Data: Full Text (Upload PDF)PPT (Upload PPT)SimilarReferenceCitedUpload PPTYour rating :0 TagsCommentsSubmit
