A Multi-Wavelength 3d-Compatible Silicon Photonics Platform On 300mm Soi Wafers For 25gb/S Applications

F. Boeuf,S. Cremer, N. Vulliet,T. Pinguet,A. Mekis,G. Masini,L. Verslegers, P. Sun, A. Ayazi,N. -K. Hon,S. Sahni, Y. Chi,B. Orlando, D. Ristoiu,A. Farcy, F. Leverd,L. Broussous, D. Pelissier-Tanon,C. Richard, L. Pinzelli, R. Beneyton, O. Gourhant, E. Gourvest, Y. Le-Friec, D. Monnier, P. Brun, M. Guillermet,D. Benoit, K. Haxaire, J. R. Manouvrier,S. Jan, H. Petiton,J. F. Carpentier,T. Quemerais, C. Durand,D. Gloria, M. Fourel, F. Battegay, Y. Sanchez, E. Batail, F. Baron,P. Delpech, L. Salager,P. De Dobbelaere, B. Sautreuil

2013 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)（2013）

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摘要

Recently Silicon Photonics has generated an outstanding interest for integrated optical communications. In this paper we describe a 300mm Silicon Photonics platform designed for 25Gb/s and above applications at the three typical communication wavelengths and compatible with 3D integration. Main process features and device results are described.

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silicon on insulator

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