Film Properties And Integration Performance Of A Nano-Porous Carbon Doped Oxide

Girish Dixit, Lester A Dcruz,Sang Ahn,Yi Zheng, Josephine Chang,Mehul Naik,Alex Demos, Derek R Witty,Hichem Msaad

PROCEEDINGS OF THE IEEE 2004 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE（2004）

引用 3|浏览2

暂无评分

摘要

A porous carbon doped oxide has been developed using a conventional PECVD reactor. Sequential electron beam treatment using a flood beam provides a means for removal of the thermally labile organic species and results in a porous material with high thermal stability. Film properties and integration results presented show the viability of integrating this film into a conventional dual damascene interconnect flow.

查看译文

关键词

thermal stability,chemical vapor deposition,copper,dielectric materials,carbon,electron beam,organic materials,films,permittivity

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要