Hybrid solder-adhesive bonding using simple resin planarization technique for 3D LSI

Masatsugu Nimura,Katsuyuki Sakuma,Hiroshi Ogino,Tomoyuki Enomoto,Akitsu Shigetou,Shuichi Shoji,Jun Mizuno

2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration（2012）

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摘要

This paper describes hybrid solder-adhesive bonding using simple resin planarization technique for three dimensional (3D) large scale integrated circuit (LSI). The resin planarization technique is effective to remove resin on the bump surface. The results of hybrid bonding show that chip bonding and underfilling of narrow gap was achieved at same time.

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关键词

planarization,three dimensional,chip,silicon

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