Full Copper Electrochemical Mechanical Planarization (Ecmp) As A Technology Enabler For The 45 And 32nm Nodes

M. Mellier, T. Berger,R. Duru,M. Zaleski, M. C. Luche, A. Rivoire, C. Goldberg, G. Wyborn, K-L. Chang, Y. Wang, V. Ripoche, S. Tsai, A. Thothadri, W-Y. Hsu, L. Chen

PROCEEDINGS OF THE IEEE 2007 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE（2007）

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cu,planarization,chemical processes,copper,surfaces,slurries,chemical mechanical polishing,lithography,nanoelectronics,dielectric materials

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