Methods of forming conductive copper-based structures using a copper-based nitride seed layer without a barrier layer and the resulting deviceXunyuan Zhang,Larry Zhao,Ming He,Sean Lin, John A Iacoponi,E T Ryanmag（2014）引用 23|浏览3暂无评分AI 理解论文溯源树样例生成溯源树，研究论文发展脉络Chat Paper正在生成论文摘要
