Characterization of micro-bump C4 interconnects for Si-carrier SOP applications

Electronic Components and Technology Conference, pp. 633-+, 2006.

Cited by: 58|Views21


This paper describes yield, contact resistance, and preliminary reliability test results on micro-bump C4 interconnects in modules containing Si-chips and Si-carriers. Modules containing eutectic PbSn or SnCu bump solders were fabricated with high yield, with similar interconnect contact resistances for both solders. The contact resistanc...More



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