Fine Pitch Tsv Integration In Silicon Micropin-Fin Heat Sinks For 3d Ics
2012 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE (IITC)(2012)
摘要
Future high performance 3D systems require a systematic co-design of their electrical interconnect network and their heat removal mechanism. This paper presents fine pitch (20 mu m) and high aspect ratio (18:1) TSVs integrated in a micropin-fin heat sink capable of removing power density of 100W/cm(2) and resulting in junction temperatures below 50 degrees C.
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关键词
silicon,3d ic,integrated circuit packaging,junction temperature,temperature measurement,integrated circuit design,resistance,heat sinks,power density,si
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