Mechanical and electrical properties of Sb-Ga50Au10In40 alloys

In this publication, results are presented which have been obtained by investigation of mechanical and electrical properties of alloys belonging to Sb-Ga50Au10In40 section of quaternary Au-Ga-In-Sb system, which is the basis for the development of new lead-free solder materials. The experiments were conducted using Brinell method for hardness measurement, apparatus PTM-3 for microhardness measurement and instrument Foerster SIGMATEST 2.069 for measuring of electrical conductivity. The microstructure of samples was analyzed using optical microscopy.