Advanced High Accuracy Scanning Electron Microscopy Review Methodology By Virtual Defect

Yiting Kuo,Yi-Lung Fang,Hsiang-Chou Liao,Ling-Wu Yang,Tahone Yang,Kuang-Chao Chen

2015 Joint e-Manufacturing and Design Collaboration Symposium (eMDC) & 2015 International Symposium on Semiconductor Manufacturing (ISSM)（2015）

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摘要

The exact location of defect is very important for review SEM. It is necessary to provide high accuracy defect review with line width shrinkage in manufacture of semiconductor. In this paper, we proposed a new methodology of defect deskew by virtual defects (VD) which provide high accuracy defect review. Furthermore, we also compare the result of different inspection modes and different pixel sizes.

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关键词

Virtual Defect, Defect Deskew, Defect Offset

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