Autocatalysis during Electroless Copper Deposition using Glyoxylic Acid as Reducing Agent

robert preisser
robert preisser

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, pp. D3004-D3008, 2013.

Cited by: 28|Views2

Abstract:

Interactions between the cathodic and anodic processes during electroless Cu deposition using glyoxylic acid reducing agent are studied. It is shown that application of the mixed potential theory by decoupling the anodic and cathodic processes leads to erroneous predictions of the electroless deposition rate and the surface mixed potentia...More

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