Electrochemical Copper Metallization of Glass Substrates Mediated by Solution-Phase Deposition of Adhesion-Promoting Layers
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, pp. D630-D634, 2015.
Metal-to-glass interfaces commonly encountered in electronics and surface finishing applications are prone to failure due to intrinsically weak interfacial adhesion. In the present work, an 'all-wet' process (utilizing solution-phase process steps) is developed for depositing nucleation- and adhesion-promoting layers that enhance the inte...More
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