Effect of Sputter Power on the Photobias Stability of Zinc-Tin-Oxide Field-Effect Transistors

This study examined the effect of sputtering power on the performance of zinc-tin-oxide field-effect transistors and the stability under photobias stress. Large improvements in the saturation mobility and subthreshold swing were found in devices fabricated at higher sputtering powers; 13.80 cm2/V·s, 0.33 V/decade at a power of 400 W compared with 2.70 cm2/V·s, 1.19 V/decade at a power of 50 W. The threshold voltage shift under negative bias illumination stress (NBIS) for the device fabricated at a power of 400 W shows superior properties (−2.41 V) compared with that (−5.56 V) of the device fabricated at 50 W. The improvements in electrical performance and NBIS stability were attributed to the formation of a denser film and the reduced dielectric/channel interfacial trap densities due to the more energetic bombardment used under high power sputtering conditions.