High-aspect ratio through-silicon vias for the integration of microfluidic cooling with 3D microsystems

Microelectronic Engineering, Volume 142, Issue C, 2015, Pages 30-35.

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Abstract:

Microfluidic cooling technology is a promising thermal solution for high-performance three-dimensional integrated circuits (3D ICs). However, the integration of microfluidic cooling into 3D ICs inevitably impacts tier-to-tier through-silicon vias (TSVs) by increasing their length and diameter (for a fixed aspect ratio). To address this ch...More

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