Temperature Modeling and Emulation of an ASIC Temperature Monitor System for Tightly-Coupled Processor Arrays (Tcpas)

E. Glocker,S. Boppu,Q. Chen,U. Schlichtmann,J. Teich,D. Schmitt-Landsiedel

Advances in radio science（2014）

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摘要

This contribution provides an approach for emulating the behaviour of an ASIC temperature monitoring system (TMon) during run-time for a tightly-coupled processor array (TCPA) of a heterogeneous invasive multi-tile architecture to be used for FPGA prototyping. It is based on a thermal RC modeling approach. Also different usage scenarios of TCPA are analyzed and compared.

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