A Spatio-Temporal Defect Process Model for Competing Progressive Breakdown Modes of Ultra-Thin Gate Oxides.

IEEE Transactions on Reliability(2016)

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摘要
Continuous downscaling of metal-oxide-semiconductor field effect transistor (MOSFET) devices has led to reliability concerns, and requires a fundamental understanding of their failure mechanisms. In particular, gate oxide breakdown is a key mechanism limiting the lifetimes of MOSFET devices. By combining stochastic defect generation processes, and the time required to construct percolation paths b...
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关键词
Electric breakdown,Logic gates,Leakage currents,MOSFET,Numerical models,Weibull distribution,Semiconductor device modeling
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