The Impact Of 3d Stacking On Gpu-Accelerated Deep Neural Networks: An Experimental Study

In this work, we present a two-tier air-cooled thermal testbed composed of an NVIDIA Tesla K40 GPU and a heater/thermometer top die. The top die has four independently controllable heaters, which can emulate a wide range of components, ranging from low power memory to high-performance multi-core processor cores. The performance and temperature of the bottom-tier GPU on several deep neural network workloads is investigated as a function of increasing top-die power dissipation, and the implications for 3DIC cooling are discussed. Index Terms Three-dimensional integrated circuits,