Impact of HF-based cleaning solutions on via resistance for sub-10nm BEOL structures
Microelectronic Engineering(2016)
摘要
In this work, ultra-dilute HF systems with the addition of functional hydrocarbon as an additive at elevated temperatures were evaluated to remove the post reactive ion etching (RIE) residues in a controlled chamber with ambient O2 concentration
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关键词
Multiple patterning,Via interface,Cu surface cleaning,Ultra-dilute HF solutions
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