2.5 A 7nm FinFET 2.5GHz/2.0GHz Dual-Gear Octa-Core CPU Subsystem with Power/Performance Enhancements for a Fully Integrated 5G Smartphone SoC

Hugh Mair,Ericbill Wang,Ashish Nayak,Rolf Lagerquist,Loda Chou,Gordon Gammie,HsinChen Chen,Lee-Kee Yong,Manzur Rahman,Jenny Wiedemeier,Ramu Madhavaram,Alex Chiou,Blundt Li,Vincent Lin,Rory Huang,Michael Yanq,Achuta Thippana,Osric Su,S. A. Huang

2020 IEEE International Solid- State Circuits Conference - (ISSCC)（2020）

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摘要

This paper introduces the heterogenous CPU complex of a fully integrated 5G mobile Smartphone SoC, implemented in 7nm FinFET technology. Circuit techniques developed to achieve competitive CPU PPA are detailed, and associated silicon results are presented.

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关键词

silicon,competitive CPU PPA,dual-gear octa-core CPU subsystem,integrated 5G mobile smartphone SoC,FinFET technology,heterogenous CPU complex,size 7.0 nm,frequency 2.5 GHz,frequency 2.0 GHz,Si

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