Study on Degradation of SF6 in the Presence of H2O and O2 Using Dielectric Barrier Discharge.

In this paper, a method using dielectric barrier discharge for SF6 abatement is investigated. The destruction and removal efficiencies (DRE) of plasma abatement of 2% SF6 in the presence of H2O and O-2 were studied. The addition of H2O and O-2 effectively promoted the decomposition process of the SF6. With the participation of 0.5% H2O and 2%O-2, the DRE reached 98.2% at 50mL/min flow rate and the energy efficiency reached 5.73 g/kWh. By emission spectra and products composition analysis, we found that the addition of H2O can generate a large amount of H and OH radicals in plasma region, making SF6 tend to degrade to produce SO2. The addition of O-2 can generate a large amount of O radicals, which promotes the production of SO2F2. The addition gas not only affects the type of products, but also determines the selectivity of each degradation product. The results in this paper provide experimental support for the treatment of SF6 tail gas using low temperature plasma.