Research of circuit manufacturing for new MID technology development

Journal of Mechanical Science and Technology(2017)

引用 4|浏览5
暂无评分
摘要
Recently in the electronics industry, the circuits are growing more and more complex as the number of components increase due to high-performance electronics product development. Accordingly, the trend is smaller, lighter, and higher-concentration electrical circuit, and the new process technology development for such is persistently in progress. Currently, electronics products are restricted in their forms for PCB and product form design due to the increase in the number of components, and there are not only the environmental issues but also unnecessary labor due to the increase in assembly processes. PCB production technology is cheap and convenient, yet has environmental issues. In order to produce PCB, various environmentally harmful chemical substances (Halogen, sulfuric acid, chloric acid, nitric acid, hydrofluoric acid, caustic soda, thinner, etc.) are needed, and a separate chemical substance monitoring system is needed. MID technology can omit such PCB production process and form circuit on the product surface.
更多
查看译文
关键词
MID (Molded interconnect device),3D printing,PCB (Printed circuit board)
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要